| Test Type | Purpose | Application Example | |-----------|---------|----------------------| | Visual & X-ray inspection | Detect cracks, corrosion, rework | PCBs, connectors, capacitors | | Parametric electrical test | Verify gain, leakage, timing | ICs, transistors, relays | | Burn-in (48–168 hrs at elevated temperature) | Expose infant mortality failures | Power semiconductors | | Thermal shock | Detect delamination or solder joint weakness | Automotive control modules | | Vibration + operational test | Intermittent fault detection | Electromechanical parts (fans, switches) |

: Used parts must be evaluated to confirm they meet the same performance criteria as their new counterparts.

– The 2004 edition predates modern trends like IoT-enabled condition monitoring and AI-based fault prediction. A revised edition (planned as of 2024 under IEC/TC 56) is expected to include data-driven residual life assessment.